ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,179, issued on July 14, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor package and method for marking ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,180, issued on July 14, was assigned to LAPIS TECHNOLOGY Co. LTD. (Yokohama, Japan). "Semiconductor device and manufacturing method of semi... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,181, issued on July 14, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Method and device for making integrated cooling liquid cavity i... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,182, issued on July 14, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Method for manufacturing package stru... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,183, issued on July 14, was assigned to TOPPAN INC. (Tokyo). "Method for manufacturing wiring board" was invented by Yuki Umemura (Tokyo), ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,184, issued on July 14, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor module" was invented by Kensuke Takeuchi (Tokyo).... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,185, issued on July 14, was assigned to NXP B.V. (Eindhoven, Netherlands). "Semiconductor device with leadframe spacer and method therefor"... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,186, issued on July 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Cavities in package conductive terminals" was invented by Jeffers... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,187, issued on July 14, was assigned to AMERICAN AXLE & MANUFACTURING INC. (Detroit). "Electric drive module" was invented by James P. Down... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,188, issued on July 14, was assigned to Allegro MicroSystems LLC (Manchester, N.H.). "Multi-die integrated circuit device with a spark gap"... Read More